 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| MMBZ5221BW - MMBZ5259BW 200mW SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features * * * * * * * Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes Lead Free/RoHS Compliant (Note 2) Qualified to AEC-Q101 Standards for High Reliability "Green" Device (Notes 3 and 4) Mechanical Data * * * * * * * * Case: SOT-323 Case Material: Molded Plastic, "Green" Molding Compound (Note 4). UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.006 grams (approximate) Top View Device Schematic Maximum Ratings Forward Voltage @TA = 25C unless otherwise specified @ IF = 10mA Symbol VF Value 0.9 Unit V Characteristic Thermal Characteristics Characteristic Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient Air (Note 1) Operating and Storage Temperature Range Notes: 1. 2. 3. 4. Symbol PD RJA TJ, TSTG Value 200 625 -65 to +150 Unit mW C/W C Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. No purposefully added lead. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 1 of 5 www.diodes.com April 2009 (c) Diodes Incorporated MMBZ5221BW - MMBZ5259BW Electrical Characteristics Type Number Marking Code Nom (V) 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 28 30 33 36 39 @TA = 25C unless otherwise specified Test Current IZT Max (V) 2.52 2.84 3.15 3.47 3.78 4.10 4.52 4.94 5.36 5.88 6.30 6.51 7.14 7.88 8.61 9.56 10.50 11.55 12.60 13.65 15.75 16.80 18.90 21.00 23.10 25.20 28.35 29.40 31.50 34.65 37.80 40.95 mA 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 9.5 8.5 7.8 7.0 6.2 5.6 5.2 5.0 4.5 4.2 3.8 3.4 3.2 Maximum Zener Impedance (Note 6) ZZT @ IZT 30 30 30 28 24 23 22 19 17 11 7.0 7.0 5.0 6.0 8.0 10 17 22 30 13 16 17 21 25 29 33 41 44 49 58 70 80 1200 1300 1600 1600 1700 1900 2000 1900 1600 1600 1600 1000 750 500 500 600 600 600 600 600 600 600 600 600 600 600 600 600 600 700 700 800 ZZK @ IZK = 0.25mA Maximum Reverse Leakage Current (Note 5) IR A 100 75 50 25 15 10 5.0 5.0 5.0 5.0 5.0 5.0 3.0 3.0 3.0 3.0 3.0 2.0 1.0 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 @ VR V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 7.0 8.0 8.4 9.1 9.9 11 12 14 15 17 18 21 21 23 25 27 30 Zener Voltage Range (Note 5) VZ @ IZT Min (V) 2.28 2.57 2.85 3.14 3.42 3.71 4.09 4.47 4.85 5.32 5.70 5.89 6.46 7.13 7.79 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.00 20.90 22.80 25.65 26.60 28.50 31.35 34.20 37.05 MMBZ5221BW MMBZ5223BW MMBZ5225BW MMBZ5226BW MMBZ5227BW MMBZ5228BW MMBZ5229BW MMBZ5230BW MMBZ5231BW MMBZ5232BW MMBZ5233BW MMBZ5234BW MMBZ5235BW MMBZ5236BW MMBZ5237BW MMBZ5239BW MMBZ5240BW MMBZ5241BW MMBZ5242BW MMBZ5243BW MMBZ5245BW MMBZ5246BW MMBZ5248BW MMBZ5250BW MMBZ5251BW MMBZ5252BW MMBZ5254BW MMBZ5255BW MMBZ5256BW MMBZ5257BW MMBZ5258BW MMBZ5259BW Notes: KC1 KC3 KC5 KG1 KG2 KG3 KG4 KG5 KE1 KE2 KE3 KE4 KE5 KF1 KF2 KF4 KF5 KH1 KH2 KH3 KH5 KJ1 KJ3 KJ5 KK1 KK2 KK4 KK5 KM1 KM2 KM3 KM4 5. Short duration pulse test used to minimize self-heating effect. 6. f = 1KHz. 0.4 50 PD, POWER DISSIPATION (W) 40 0.3 IZ, ZENER CURRENT (mA) 30 0.2 20 0.1 10 0 0 100 125 25 50 75 TA, AMBIENT TEMPERATURE (C) Fig. 1 Power Derating Curve 150 0 0 3 4 5 6 8 9 10 7 VZ, ZENER VOLTAGE (V) Fig. 2 Typical Zener Breakdown Characteristics 1 2 MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 2 of 5 www.diodes.com April 2009 (c) Diodes Incorporated MMBZ5221BW - MMBZ5259BW 30 Tj = 25C 10 12 1,000 Tj = 25 C f = 1MHz 20 Test current IZ 15 Nominal Zener Voltage CT, TOTAL CAPACITANCE (pF) IZ, ZENER CURRENT (mA) 18 100 VR = 1V 10 22 27 33 36 39 VR = 2V 0 0 10 20 30 40 VZ, ZENER VOLTAGE (V) Fig. 3 Typical Zener Breakdown Characteristics 10 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage 1 1,000 100 100 PPK, PEAK SURGE POWER (W) ZZ, ZENER IMPEDANCE () 10 10 1 1 10 100 VZ, ZENER VOLTAGE (V) Fig. 5 Typical Zener Impedence Characteristics 1 1 1,000 10 100 PULSE WIDTH (ms) Fig. 6 Maximum Non-repetitive Surge Power Ordering Information Device (Type Number)-7-F* (Notes 4 & 7) Packaging SOT-323 Shipping 3000/Tape & Reel * Add "-7-F" to the appropriate type number in Electrical Characteristics Table from Page 2. Example: 6.2V Zener = MMBZ5234BW-7-F. Notes: 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information xxx = Product Type Marking Code (See Electrical Characteristics Table) YM = Date Code Marking Y = Year (ex: N = 2002) M = Month (ex: 9 = September) 2004 R 2005 S Jun 6 2006 T Jul 7 2007 U Aug 8 2008 V Sep 9 2009 W Oct O 2010 X 2011 Y Nov N 2012 Z Dec D April 2009 (c) Diodes Incorporated xxx Date Code Key Year Code Month Code 1998 J Jan 1 1999 K 2000 L Feb 2 2001 M Mar 3 2002 N Apr 4 YM 2003 P May 5 MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 3 of 5 www.diodes.com MMBZ5221BW - MMBZ5259BW Package Outline Dimensions A BC G H K M J D L SOT-323 Dim Min Max Typ A 0.25 0.40 0.30 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D 0.65 G 1.20 1.40 1.30 H 1.80 2.20 2.15 J 0.0 0.10 0.05 K 0.90 1.00 1.00 L 0.25 0.40 0.30 M 0.10 0.18 0.11 0 8 All Dimensions in mm Suggested Pad Layout Y Z C Dimensions Value (in mm) Z 2.8 X 0.7 Y 0.9 C 1.9 E 1.0 X E MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 4 of 5 www.diodes.com April 2009 (c) Diodes Incorporated MMBZ5221BW - MMBZ5259BW IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2009, Diodes Incorporated www.diodes.com MMBZ5221BW - MMBZ5259BW Document number: DS31037 Rev. 13 - 2 5 of 5 www.diodes.com April 2009 (c) Diodes Incorporated |
Price & Availability of MMBZ5221BW09
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |